Teradyne Stock Price, News & Analysis

Universal Robots (UR) has unveiled its fastest collaborative robot, the UR15, at Automate in Detroit. The new cobot features a maximum TCP speed of 5 m/s and delivers up to 30% cycle time improvements in pick-and-place applications compared to other UR models. The UR15 offers a payload capacity of 15 kg (expandable to 17.5 kg for wrist-down operations) and is powered by PolyScope X software platform with AI capabilities through the UR AI Accelerator, developed in partnership with NVIDIA. The cobot is designed for various industries including automotive, metal and machining, and electronics, featuring IP65 protection and cleanroom compatibility. The launch coincides with updates to UR's e-Series, including payload upgrades and renaming of models. The UR15 is available for orders now, with shipping starting in June 2025.

Teradyne (NASDAQ:TER) has announced a quarterly cash dividend payment of $0.12 per share. The dividend will be paid on June 13, 2025, to shareholders who are recorded as owners of TER stock at the close of business on May 22, 2025. This dividend announcement demonstrates Teradyne's commitment to returning value to shareholders through regular cash distributions.

Teradyne reported strong Q1 2025 financial results with revenue of $686 million, marking a 14% increase from Q1 2024. The company's performance was primarily driven by robust growth in Semiconductor Test, which contributed $543 million to total revenue.

Key financial highlights include:

• GAAP EPS: $0.61
• Non-GAAP EPS: $0.75
• Net income: $98.9 million (GAAP)
• Robotics revenue: $69 million
• Product Test revenue: $74 million

The company announced a significant expansion of its share repurchase program from $400M to $1 billion, to be completed by 2026. Looking ahead, Teradyne projects Q2 2025 revenue between $610-680 million, with GAAP EPS of $0.35-0.58 and non-GAAP EPS of $0.41-0.64. CEO Greg Smith noted strong growth in System-on-a-Chip testing for Mobile applications, while acknowledging limited visibility for the second half amid market uncertainties.

Universal Robots (UR) and Mobile Industrial Robots (MiR), both Teradyne Robotics companies, will showcase their automation solutions at Automate 2025 in Detroit from May 12-15. The companies will occupy the largest exhibition area at booths #4023 and #3623.

The showcase will feature three specialized zones: Automotive, featuring explosion-proof cobot painting and AI-powered quality inspection; Electronics Manufacturing, introducing the new OptiMove feature for improved cobot movements and AI Accelerator toolkit developed with NVIDIA; and Material Handling & Logistics, demonstrating integrated autonomous solutions including the MiR1200 Pallet Jack and the award-winning MC600 mobile cobot system.

Group President Ujjwal Kumar will deliver a keynote on 'Tech Hype vs Industrial Need' on May 15, highlighting their comprehensive approach to automation across industries.

Teradyne (NASDAQ: TER) has scheduled the release of its first quarter 2025 financial results on Monday, April 28, 2025, after 5:00 p.m. ET. The company will host a conference call on Tuesday, April 29, 2025, at 8:30 a.m. ET to discuss the quarterly results and management's business outlook.

Investors can access the webcast through the company's investor relations website at investors.teradyne.com/events-presentations. Presentation materials will be made available at the start of the call, and a replay will be accessible on the company's website.

Teradyne (TER) has partnered with ficonTEC to launch the first high-volume, double-sided wafer probe test cell for silicon photonics. The innovative solution combines Teradyne's UltraFLEXplus automated test equipment and IG-XL programming environment with ficonTEC's optical alignment, probing, and wafer handling technologies.

The system enables testing of hybrid bonded PIC/EIC wafers in production environments, addressing the growing demand for high-throughput electro-optical testing driven by co-packaged optics (CPO) applications. While partnering with ficonTEC for immediate market deployment, Teradyne maintains an open ecosystem approach, ensuring UltraFLEXplus compatibility with various industry-leading optical instruments and systems.

This solution facilitates known good die testing before wafer dicing and packaging into CPO devices or pluggable transceivers, integrating efficiently with existing fab and OSAT test floor infrastructure.

Teradyne Robotics is set to showcase groundbreaking AI-powered robotics solutions at NVIDIA GTC 2025 (March 17-21), marking the first public demonstration of their AI Accelerator in commercial applications. The AI Accelerator toolkit, developed by Teradyne's Universal Robots in collaboration with NVIDIA, integrates with PolyScope X software platform and runs on NVIDIA Jetson AGX Orin system.

Five robotics companies will demonstrate new applications powered by the AI Accelerator 1.1, including:

• 3D Infotech's dynamic metrology solution
• T-Robotics' GenAI-driven programming
• AICA's reinforcement learning assembly
• Acumino's bimanual assembly
• Groundlight's workpiece detection system

The technology enables robots to learn, adapt, and make informed decisions based on sensory input, addressing complex use cases in logistics, construction, and manufacturing environments.

Mobile Industrial Robots (MiR) has launched the MiR VDA 5050 Adapter, a software solution enabling interoperability between MiR's autonomous mobile robots (AMRs) and VDA 5050-compatible third-party fleet management systems. The adapter facilitates standardized management of diverse robot fleets in warehouses, distribution centers, and manufacturing facilities.

Developed in partnership with industry leaders including MHP, SYNAOS, Siemens SIMOVE, and KINEXON, the adapter connects MiR's RESTFUL robot interface with MQTT protocols for VDA message exchange. This integration aims to improve traffic management and operational coordination across different automated vehicles, from AMRs to specialized forklifts and high-reach trucks.

The VDA 5050 standard, initiated by the German Automotive Industry Association and VDMA Material Handling and Intralogistics Association, enables communication between multiple AMR types through a common control system. The adapter is available globally through certified system integrators, with optional support agreements for updates and compatibility maintenance.

Teradyne (TER) has announced a definitive agreement to acquire Quantifi Photonics, a leader in photonic IC testing. The acquisition, expected to close in Q2 2025, aims to deliver scalable photonic integrated circuit (PIC) test solutions for the high-performance Compute market supporting AI workloads.

The strategic move combines Teradyne's semiconductor ATE leadership with Quantifi Photonics' expertise in photonic testing to develop cost-effective, high-throughput test solutions for wafer-level, die/multi-die and co-packaged optical module testing. The integration focuses on addressing the growing bandwidth and power requirements driven by Cloud AI applications through optical interconnect solutions.